Growth methods
The earliest Ge QWs were grown by molecular beam epitaxy (MBE), which uses solid sources. The growth rate is generally quite low but is independent of substrate temperature. The system needs to be opened to refill the sources, making thick layers impractical.
Chemical vapor deposition (CVD) uses gases such as silane (SiH4) and germane (GeH4), and sometimes hydrogen as a carrier gas. Reduced-pressure CVD is now standard technology for SiGe growth in research and industry. Growth is thermally activated by the hot substrate so can be 1-2 nanometres per second at high temperatures during buffer growth, but much slower at the lower temperatures required for strained layers. The material is of very high quality.
In LEPECVD, CVD growth is enhanced with a low-energy plasma, so the growth can be fast and independent from substrate temperature. Well-defined QWs with sharp interfaces are grown at reduced plasma density and gas flow.
Main takeaways
- MBE is a useful and flexible too for research but is impractical for the growth of large quantities of SiGe.
- Reduced-pressure CVD has become standard for growing high quality SiGe both in research and industry.
- LEPECVD is in use at the Politecnico di Milano in Como for the growth of thick SiGe layers for research.
Further thinking
True or False: The substrate must be kept away from the plasma in the LEPECVD growth chamber so that ions do not damage the crystalline structure of the deposited layers.
Further reading
For MBE of Ge QWs, Y. H. Xie et al., Very high mobility two-dimensional hole gas in Si/GexSi1-x/Ge structures grown by molecular beam epitaxy. Appl. Phys. Lett. 63 (16) 2263--2264 (1993) https://aip.scitation.org/doi/10.1063/1.110547
For reduced-pressure CVD, Y. Bogumilowicz et al. High-temperature growth of very high germanium content SiGe virtual substrates. J. Cryst. Growth 290 (2) 523--531 (2006) http://dx.doi.org/10.1016/j.jcrysgro.2006.02.019
For LEPECVD, Hans von Känel et al., Very high hole mobilities in modulation-doped Ge quantum wells grown by low-energy plasma enhanced chemical vapor deposition. Appl. Phys. Lett. 80 (16) 2922--2924 (2002) https://aip.scitation.org/doi/10.1063/1.1470691